Genesis Silicon 801 heat sink compound 11 W/m·K

<b>SILICON 801</b><br>Genesis Silicon 801 is thermal paste that will live up to the expectations of powerful PCs owners, whose systems are built from components that require exceptional solutions to achieve optimal working temperatures.<br><br><b>FOLLOWS ALL REQUIREMENTS</b><br>To meet those high-demands Silicon 801 paste delivers high thermal conductivity, low thermal resistance, does not conduct electricity, does not corrode and does not require curing time – it achieves optimal thermal performance from the very first power-up cycle of a given component, on which the paste has been applied.<br><br><b>AN EASY APPLICATION</b><br>Due to the use of handy syringe, application and storage won’t be a problem even for less experienced users.GENESIS Silicon 801. Thermal conductivity: 11 W/m·K, Density: 2.1 g/cm³, Constitutive ingredients: Silicone. Volume: 0.2 ml. Quantity per pack: 1 pc(s), Package type: Blister