AKASA T6 ProGrade Max heat sink compound Thermal paste 14.8 W/m·K 4 g

Experience ultra-performing thermal paste designed to optimize heat transmission to your CPU or GPU, ensuring superior cooling efficiency and delivering exceptional thermal conductivity for maximum performance.<br><br><b>T6 ProGrade Max</b><br>Thermal Compound ProGrade Max T6<br><br><b>Ultra Performing Thermal Conductivity</b><br>Our thermal paste boasts exceptional thermal conductivity up to 14.8 W/mk, ensuring optimal heat dissipation for peak performance in high-demand applications.<br><br><b>Non-Electrical Conductivity for Safety</b><br>Not only does our paste excel in heat transfer but is also non-electrically conductive, providing a safe and reliable solution for your electronic components. Ensure effective cooling without the risk of electrical interference.<br><br><b>Non-Curing Properties</b><br>Experience hassle-free maintenance with our pastes' non-curing properties, eliminating the need for waiting times. This means you can achieve peak performance right from the start, ensuring efficient cooling without delays<br><br><b>Wipes and Spreader</b><br>Make application a breeze with our thermal paste kit, thoughtfully equipped with clean wipes (x2) and a spreader for a mess-free and convenient experience.<br><br>Akasa T6 ProGrade Max. Type: Thermal paste, Thermal conductivity: 14.8 W/m·K, Product colour: Grey. Weight: 4 g. Quantity per pack: 1 pc(s), Package width: 130 mm, Package depth: 60 mm