AKASA AK-TT600-KT03 heat sink compound Thermal pad 6 W/m·K

<b>70x20x1.5mm, Ceramic Filled Silicone Elastomer</b><br><br>Advanced thermally conductive M.2 SSD interface pad optimises heat dissipation with a 400% increased thermal conductivity between components and heatsinks. It seamlessly adapts to uneven surfaces for improved performance. 3-Pack.<br><br><b>Hi-Performance Thermal Pads</b><br>Thermal pad has a high temperature range from -40° up to 160°. Ceramic filled silicon ensures that the pad will not melt, as well as being non corrosive and non electrically conductive. With a 400% conductivity rating inceased thermal conductivity.<br><br><b>Easily Installed</b><br>Thermal pad moulds around uneven surfaces to ensure most surface area is in contact to help conduct as much heat as possible. Pad can also be cut to size easily according with your needs.<br><br><b>Perfect Fit For Common M.2 SSD (2280)</b><br><br><b>Reliable and Stable Connection</b><br>Ceramic filled silicon allows pad to mold into any surface imperfections allowing the connection to be smoother operate more efficiently.<br><br><b>Wide Usage</b><br>Thermal pad can be used on a wide range of components ranging from CPU, GPU, RAM, SSD and LED's. Comes in a pack of 3.<br>Akasa AK-TT600-KT03. Type: Thermal pad, Thermal conductivity: 6 W/m·K, Density: 2.95 g/cm³. Width: 70 mm, Depth: 20 mm, Height: 1.5 mm. Quantity per pack: 3 pc(s)