Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/m·K 3 g

Xilence X5 thermal paste was specifically designed for high-end processors. The very high thermal conductivity ensures for an efficient heat exchange and low temperatures! The paste works reliably at temperatures from -50 to +300°C – therefore, it is particularly well suited for extreme overclocking. Since the X5 is not electrically conductive, there is no danger for the surrounding hardware! Contents: 2.5 g.Xilence ZUB-XPTP.X5. Thermal conductivity: 5.15 W/m·K, Product colour: Black, Red, White, Viscosity note: 73 CPS. Weight: 3 g. Quantity per pack: 1 pc(s), Package width: 120 mm, Package depth: 20 mm