Termopasta GEMBIRD TG-G3.0-01 heat sink compound 4.5 W/m·K 3 g

— Thermal compund (grease) for heatsinks<br>- Helps the heat dissipation from a CPU, chipset or processor to a heatsink<br>- Excellent thermal impedance<br>- Perfect stability — will not separate, run, migrate, or bleed<br>- Non capacitive or electrically conductiveGembird TG-G3.0-01. Thermal conductivity: 4.5 W/m·K, Product colour: Grey, Viscosity note: 76 CPS. Width: 120 mm, Depth: 180 mm, Height: 15 mm. Package width: 380 mm, Package depth: 390 mm, Package height: 280 mm